Huawei cuts ribbon on Shanghai R&D center

zhuzijun / 2020-09-29

Huawei Technologies Co Ltd on Sunday kicked off the groundbreaking ceremony of an R&D center in Shanghai's Qingpu district, as the technology giant takes one step further to deepen strategic cooperation with the metropolis.

Attended by Shanghai Mayor Gong Zheng and Huawei Chairman Liang Hua, the ceremony also witnessed the signing of a cooperation framework, under which the company and the Shanghai municipal government pledged to strengthen technology research and development and application in the fields of integrated circuits, software and information services, internet of things, internet of vehicles, industrial internet and smart city demonstration applications.

Covering an area of 2,400 mu (1.6 million square meters), the center serves as a base for strengthening technology R&D, demonstration of applications and integrated innovation, to expanding Huawei's business scope in the city and contributing to innovative development in information infrastructure and smart city building.